AMRMT 2019 Speaker

Prof. Ruxu Du (Keynote Speaker)

Fellow, Society of Manufacturing Engineers (SME)

Fellow, America Society of Mechanical Engineers (ASME)

Fellow, Hong Kong Institute of Engineers (HKIE)

South China University of Technology, China













Title of Speech: Resilient Manufacturing System

Abstract: In the past two years, the world manufacturing environment has been completely changed from globalization to nationalization. As a result, companies large or small will have to face ever increased government regulation, resources restriction and market limitation.  To survive such a harsh environment, companies will have to make their manufacturing system resilient.
In this talk, we introduced the idea of resilient manufacturing system. It consists of four parts:

  • Product design and optimization. This includes
  • Analyze the product to find alternative designs which do not dependent on single or strangling resources. For example, a design with strong dependence on specific patents and intellectual rights shall be modified.
  • Analyze the product to find alternative materials which do not dependent on single or strangling resources. For example, a design with strong dependence on a specific alloy shall be modified to use different materials, different coating, as well as different sizes and geometries.
  • Optimize the design using multi-physics simulation and automated design. For example, one can use the honeycomb structure to reduce the weight and yet maintain the same strength.
  • Manufacturing system modeling and optimization. This includes
  • Modeling the manufacturing system to find bottleneck stations and/or bottleneck supplies so that the system reliability can be maximized. For example, a bottleneck station shall be redesigned to include buffers and/or a parallel station. Also, bottleneck supply shall be minimized by developing additional supplies through data mining.
  • Develop a digital twin for manufacturing system so that its operation can be easily viewed and managed.
  • On-line monitoring and control of critical machines and stations in manufacturing systems. This is a key part of intelligent manufacturing. Various sensors, algorithms and computer control systems will be used.
  • Alternative manufacturing methods. In the past decade, several new manufacturing methods have been developed. This includes
  • 3D printing. 3D printing, especially integrated 3D printing and CNC machining machines can make parts with high dimension accuracy and good surface finish. It also reduces the dependence on tedious post-processing processes.
  • Incremental forming. Eighty percent of the engineering parts are shells. Presently, these parts are made by metal forming (e.g., sheet metal stamping) and plastic forming (e.g., injection molding), in which the bottleneck is the dies and molds, which is expensive and time-consuming to make.  In the past two decades, the techniques of incremental forming, also called dieless forming, have been greatly advanced. It is particularly useful for single or small batch manufacturing.
  • Reconfigurable CNC machine tools. The idea of reconfigurable CNC machine tools is first proposed some twenty years ago.
  • Robotics
  • Logistics and supply chain management. Joint venture
  • Internet of Things (IoT).
  • Sociology

Prof. Bob Tait (Keynote Speaker)

University of Cape Town, South Africa










Title of Speech: Fracture Toughness of Polycrystalline Diamond

Abstract: This paper concerns the toughness measurement of polycrystalline diamond (PCD) cut from the leading edges of large PCD “buttons”, as used in rock cutting mining applications, and subsequently cut into plates 0.5 to1.0 mm thick.  These were themselves cut to form miniature double torsion (DT) specimens, and polished and notched appropriately.  The PCD grades comprised a range from a starter grain size of 4 microns, through 12 to 30 microns, with a fourth grade of 30/4 micron sintered composite.  The DT specimens were tested in a custom made DT rig developed to locate inside the chamber of a scanning electron microscope (SEM), facilitating observation monitoring of crack growth at micron increments.  The system was made to micron tolerances thus enabling controlled crack growth to occur, and the system was also instrumented to record full load and displacement behaviour.  The system was very reliable and repeatable and, with the attention to dimensional detail and tolerancing, straight cracking was achieved.  A tapered starter notch was introduced into the specimens and overcame the notch effect of conventional cracking.  The micro-cracking (including the crack tip) could be visually followed easily in the SEM as it developed, and features such as straight cracking, branching, crack ‘jumping’ (discontinuous cracking on the surface) were all easily monitored. The fracture toughness was also measured and ranged from 8.1 to 12 MPa√m as the grain size increased, and changes in crack path readily observed. Micro-cracking developed from intergranular to more trans-granular (as grain size increased) but also exhibited more tortuosity, which was interpreted as the crack needing to exceed the activation energy to crack the bigger grains.  It was possible to draw correlations of increasing toughness with starter grain size and also contiguity, and also a clear decrease in toughness with increasing cobalt content.  Fracture surfaces, of slow (often intergranular) crack growth versus fast (often trans-granular) brittle fracture, could be distinguished, from the different cobalt content on the surface.
The DT technique is very powerful and stable, for this application to such brittle materials, but needs remarkable precision alignment and accuracy, but also points to methods to improve the toughness even further. The technique is reliable and reproducible, when made sufficiently accurately, and recently this work has been extended to use digital image correlation (DIC) and electron back scatter detection (EBSD) to monitor the crack paths. This has enabled and measurement of the (J integral) fracture toughness in a non-contact manner which exhibits complementary behaviour to the current results, and forms the subject of associated later papers.


Prof. Kikuo Kishimoto (Keynote Speaker)

Professor Emeritus, Tokyo Institute of Technology

Fellow, National Institute for Education Policy Research

Honorary Chair Professor, National Taiwan University of Science and Technology

Tokyo Institute of Technology, Japan


Title of Speech: Multi-Material Structures and Interface Mechanics

Abstract: Modern machines and structures are composed of various types of materials to realize required various demands. Multi-material structures become common and effective design methodology needs to be developed to treat complex problem of multi-materials design. In order to satisfy the design requirements and ensure the safety and reliability, it is important to understand the mechanical characteristics of materials to be employed. Bi-material system is basic element in multi-material structures and the performance of this system strongly depends on the strength of interface. Understanding the interface strength is crucial issue.
In this presentation, several mechanics of material researches relating to multi-material structures are presented such as characterization and modeling of the mechanical behaviors of the materials which are used for automobile components. The materials studied are the aluminum alloys and polymer materials and their performances are investigated under impact loading and repeated loading. Various approaches of interfacial mechanics are also reviewed. Molecular dynamic approach, singular stress approach, energy release rate approach and cohesive zone model approach are introduced and their characteristics are examined. As an example of multi-material structures, multilayer structures composed of adhesive layer is picked up. In electric devices, thin film multi-layer systems, those are composed of metals, ceramics and polymers, are commonly used and the reliability is strongly dependent on interfacial adhesion between these dissimilar materials. Several testing methods for adhesive films are presented such as adhesion test, peeling test, Nano-indentation test and probe tach test. The characteristic parameters such as energy release rate is examined



Prof. Jagannathan Sankar (Keynote Speaker)

North Carolina A&T State University, USA

Director-NSF/ERC for Revolutionizing Metallic Biomaterials

White House Millennium Researcher

Director -Center for Advanced Materials and Smart Structures (CAMSS)


Keynote Lecture: Mag (Mg) ical Metal - Revolutionizing Biodegradable Implant Technologies to Light-weighting Structures and Applications

Abstract: The current orthopedic devices that are used for complex fracture fixation is fabricated from a range of stable bioinert alloys. The limitations include a) the need for secondary surgery (high-energy trauma in the young and osteoporotic fractures in the elderly) b) mechanical properties that are not ideal for bone fixation, and c), possible release of small, but potentially toxic and irritating metal particulates. By contrast, Mg alloys offer the required properties of ultra-high ductility, high strength, and toughness but can undergo complete resorption after bone healing, eliminating multiple surgeries and reduce health care costs.
The tripartite partnership via NSF- SFI- C2C program has created convergence of academia and industry (RMB, NIBEC at Ulster University, NUI Galway, Fort Wayne Metals, Orthokinetics) in the fields of processing, surface modification, characterization, modeling and regulatory issues with the goal of developing magnesium systems for orthopedic implant device applications ranging from thin clinical “k wires” to thicker pins, rods and elastic stable intramedullary nails (IMs or ESINs) as well as meshes for the treatment of complex bone fractures.
Additionally, the Mg based alloys are widely acknowledged to have enormous potential for lightweight structural applications, given their low density, high specific strength, good castability and better damping capacity. However, to actualize the widespread interest in Mg-alloys for light weighting applications, focused efforts are required to reach the strength, ductility, and corrosion resistance design end goals.
The talk will provide pathways for developing the biodegradable implants to light weighting applications through holistic University- Industry partnerships



AMRMT Past Speaker

Prof. Roderick Smith

Imperial College, UK

Research Professor Department of Mechanical Engineering

Chairman Future Rail Research Centre Imperial College London

Chair of the Future Railway Research Centre

Vice President of the Institution of Mechanical Engineers

Honorary Visiting Professor at Central Queensland University, Australia & of the Academy of Railway Science of China and York and City universities in the UK

Prof. Jagannathan Sankar

North Carolina A&T State University, USA

Director-NSF/ERC for Revolutionizing Metallic Biomaterials

White House Millennium Researcher

Director -Center for Advanced Materials and Smart Structures (CAMSS)




Prof. Zhengwei You

Chair of the Department of Composite Materials

College of Material Science & Engineering, Donghua University






Prof. Minghui YANG

Ningbo Institute of Industrial Technology (CNITECH)

Chinese Academy of Sciences

Solid State Functional Materials Laboratory

Prof. Yu-Lung Lo

National Cheng Kung University, Taiwan, ROC

Director, Instrument Development Center

Director, NSC Instrument Center at NCKU


Dr. Shutao CHEN

Technical Development Manager, China, Solvay Specialty Polymers




Prof. Alan Kin-Tak Lau

Swinburne University of Technology, Australia

Prof.DING Jun

National University of Singapore, Singapore

Prof. Shiv G. Kapoor

University of Illinois, Urbana-Champaign, USA


Prof. Yong Tang

Shanghai institute of Organic Chemistry Shanghai, China

Prof. Ramesh Singh

University of Malaya, Malaysia



  • If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialist.
  • Ms.Sophia Liu
  • Email: amrmt@smehk.org
  • Tel: +852-30506862/8618200296850


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